Soldering
Low temperature melting alloys for zinc, tin and copper alloys.
Our pastes and powders are applied in thick film technology for printing of circuit boards and assembling of SMT-components.
Depending on the application, different materials with different grain sizes are available.
| Product | Properties |
| 99.99Sn | high strength |
| 99.3Sn0.7Cu | for simple applications |
| low cost | |
| dissolves copper at high temperatures | |
| 99Sn | high strength |
| 97Sn3Cu | for high temperature application |
| 95Sn5Sb | high shear strength |
| low thermo-dynamic fatigue | |
| 85Sn15Zn | high strength |
| high corrosion resistance | |
| 77.2Sn20In2.8Ag | Eutectic at 118°C |
| 52In48Sn | good wetting characteristics |
| low melting temperature | |
| 97In3Ag | high strength |
| good wetting characteristics | |
| low melting temperature | |
| 90In10Ag | good wetting characteristics |
| low melting temperature | |
| Au82-In Solder | good wetting characteristics |
| high melting point | |
| Sn96.5Ag3.5 | higher strength compared to SnPb solder alloys |
| Sn95Ag5 | |
| Sn94Ag6 |
Laminated braze
Vacuum Braze