Soldering
Low temperature melting alloys for zinc, tin and copper alloys.
Our pastes and powders are applied in thick film technology for printing of circuit boards and assembling of SMT-components.
Depending on the application, different materials with different grain sizes are available.
Product | Properties |
99.99Sn | high strength |
99.3Sn0.7Cu | for simple applications |
low cost | |
dissolves copper at high temperatures | |
99Sn | high strength |
97Sn3Cu | for high temperature application |
95Sn5Sb | high shear strength |
low thermo-dynamic fatigue | |
85Sn15Zn | high strength |
high corrosion resistance | |
77.2Sn20In2.8Ag | Eutectic at 118°C |
52In48Sn | good wetting characteristics |
low melting temperature | |
97In3Ag | high strength |
good wetting characteristics | |
low melting temperature | |
90In10Ag | good wetting characteristics |
low melting temperature | |
Au82-In Solder | good wetting characteristics |
high melting point | |
Sn96.5Ag3.5 | higher strength compared to SnPb solder alloys |
Sn95Ag5 | |
Sn94Ag6 |
Laminated braze
Vacuum Braze